技术参数

• Package / Case 2-XDFN
• Mounting Type Surface Mount
• Speed Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr) 2.4 ns
• Technology Schottky
• Capacitance @ Vr, F 20pF @ 10V, 1MHz
• Current - Average Rectified (Io) 1A
• Supplier Device Package DSN1006-2
• Operating Temperature - Junction 150°C (Max)
• Voltage - DC Reverse (Vr) (Max) 60 V
• Voltage - Forward (Vf) (Max) @ If 730 mV @ 1 A
• Current - Reverse Leakage @ Vr 30 µA @ 60 V
• ECCN EAR99
• HTSUS 8541.10.0080