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技术细节

  • 尺寸/外形尺寸 Board-to-Board (BTB) Socket - 360
  • 等效串联电阻 1.970" L x 3.230" W (50.00mm x 82.00mm)
  • 测量范围 MPU Core
  • 外壳镀层 ARM® Cortex®-A8, i.MX53
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