Technical Details

• Package / Case 6-XFBGA, WLCSP
• Mounting Type Surface Mount
• Operating Temperature 150°C (TJ)
• Technology MOSFET (Metal Oxide)
• FET Type P-Channel
• Current - Continuous Drain (Id) @ 25°C 7.3A (Tj)
• Power Dissipation (Max) 556mW
• Supplier Device Package 6-WLCSP (1.48x0.98)
• Drive Voltage (Max Rds On, Min Rds On) 2.5V, 4.5V
• Vgs (Max) ±8V
• Drain to Source Voltage (Vdss) 20 V
• Gate Charge (Qg) (Max) @ Vgs 19.1 nC @ 4.5 V