Technical Details

• Package / Case 338-LFBGA
• Mounting Type Surface Mount
• Interface HPI, I2C, McBSP, MMC, SD, SPI, UART, USB
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature 0°C ~ 85°C (TC)
• Non-Volatile Memory ROM (16kB)
• On-Chip RAM 32kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.35V
• Clock Rate 300MHz
• Supplier Device Package 338-BGA (13x13)