Technical Details

• Package / Case 570-BFCPGA
• Mounting Type Through Hole
• Interface BSP, HPI, PCI, SPI
• Type Fixed Point
• Operating Temperature -55°C ~ 115°C (TA)
• Non-Volatile Memory External
• On-Chip RAM 1.03125MB
• Voltage - I/O 3.30V
• Voltage - Core 1.4V
• Clock Rate 600MHz
• Supplier Device Package 570-FCPGA (33.28x33.28)