Technical Details

• Package / Case 376-BGA
• Mounting Type Surface Mount
• Speed 240MHz
• Program Memory Size 3.75MB (3.75M x 8)
• RAM Size 3.6M x 8
• Operating Temperature -40°C ~ 150°C (TJ)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 64K x 8
• Core Processor RH850G3M
• Data Converters A/D 16x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
• Peripherals DMA, I2S, LCD, LVD, POR, PWM, WDT
• Supplier Device Package 376-BGA (23x23)
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant