Technical Details

• Package / Case 64-TFBGA
• Mounting Type Surface Mount
• Speed 120MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 384K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 8K x 8
• Core Processor RXv3
• Data Converters A/D 10x12b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
• Connectivity I2C, LINbus, QSPI, SCI, SPI, USB
• Peripherals Capacitive Touch, DMA, LVD, POR, PWM, WDT
• Supplier Device Package 64-TFBGA (4.5x4.5)
• Number of I/O 43
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant