技术参数

• Package / Case 625-LFBGA, FCBGA
• Mounting Type Surface Mount
• Interface CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
• Type DSP+ARM®
• Operating Temperature 0°C ~ 90°C (TJ)
• Non-Volatile Memory External
• On-Chip RAM 1MB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.00V
• Clock Rate 1GHz
• Supplier Device Package 625-FCBGA (21x21)
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant