技术参数

• Package / Case 116-WFBGA
• Mounting Type Surface Mount
• Speed 100MHz, 150MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 288K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 32K x 8
• Core Processor ARM® Cortex®-M4/M0
• Data Converters A/D 8x12b SAR; D/A 1x12b
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
• Connectivity I2C, LINbus, QSPI, SPI, UART/USART, USB
• Peripherals Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
• Supplier Device Package 116-BGA (5.2x6.4)
• Number of I/O 78
• DigiKey Programmable Not Verified
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant