技术参数

• Package / Case 625-BFBGA, FCBGA
• Speed 533MHz, 1.3GHz
• RAM Size 256KB
• Number of I/O 180
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
• Primary Attributes Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA, WDT
• Supplier Device Package 625-FCBGA (21x21)
• Architecture MCU, FPGA
• ECCN 5A002A4 XIL
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant