技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Speed 48MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 128K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M3
• Data Converters A/D 8x12b; D/A 2x12b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.98V ~ 3.8V
• Connectivity EBI/EMI, I2C, IrDA, SmartCard, SPI, UART/USART
• Peripherals Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Supplier Device Package Wafer
• Number of I/O 93
• DigiKey Programmable Not Verified
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)