技术参数

• Package / Case 128-TFQFN, CSP Dual Rows, Thermal Pads
• Mounting Type Surface Mount
• Interface ACCESS.bus, Microwire/SPI, USART, USB
• RAM Size 32K x 8
• Operating Temperature -10°C ~ 85°C
• Voltage - Supply 2.25V ~ 2.75V
• Program Memory Type External Program Memory
• Applications Digital Imaging
• Core Processor CR16C
• Supplier Device Package 128-TECSP (10x10)
• Number of I/O 16
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant