技术参数

• Package / Case 36-XFBGA
• Mounting Type Surface Mount
• Speed 48MHz
• Program Memory Size 64KB (64K x 8)
• RAM Size 16K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M0+
• Data Converters A/D 14x16b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
• Connectivity I2C, FlexIO, SPI, UART/USART, USB
• Peripherals DMA, I2S, PWM, WDT
• Supplier Device Package 36-XFBGA (3.5x3.5)
• Number of I/O 30
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant