技术参数

• Package / Case 236-LFBGA
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 105°C (TA)
• Core Processor ARM926EJ-S
• Voltage - I/O 1.8V, 2.5V, 3.3V
• Supplier Device Package 236-MAPBGA (9x9)
• USB USB 2.0 OTG (1)
• Number of Cores/Bus Width 1 Core, 32-Bit
• RAM Controllers DDR, SDRAM
• Graphics Acceleration No
• Display & Interface Controllers LCD
• Security Features Cryptography
• Additional Interfaces AC’97, I2C, I2S, SPI, UART
• ECCN 5A002A1
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant