技术参数

• Package / Case 30-XFBGA, WLCSP
• Mounting Type Surface Mount
• Interface I2C, SPI
• RAM Size 2K x 8
• Operating Temperature 0°C ~ 70°C
• Voltage - Supply 1.71V ~ 5.5V
• Controller Series CY8C20xx7/S
• Program Memory Type FLASH (32kB)
• Applications Capacitive Sensing
• Core Processor M8C
• Supplier Device Package 30-WLCSP (2.2x2.3)
• Number of I/O 27
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant