技术参数

• Package / Case 132-BPGA Exposed Pad
• Mounting Type Through Hole
• Speed 16MHz
• Operating Temperature 0°C ~ 70°C (TA)
• Core Processor M68000
• Voltage - I/O 5.0V
• Supplier Device Package 132-PGA (34.5x34.5)
• Number of Cores/Bus Width 1 Core, 8/16-Bit
• Co-Processors/DSP Communications; RISC CPM
• RAM Controllers DRAM
• Graphics Acceleration No
• Additional Interfaces GCI, IDL, ISDN, NMSI, PCM, SCPI
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant