技术参数

• Package / Case 676-BBGA, FCBGA
• Speed 800MHz
• RAM Size 256KB
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA
• Supplier Device Package 676-FCBGA (27x27)
• Architecture MCU, FPGA
• ECCN 3A991D
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant