技术参数

• Package / Case 144-LFBGA
• Mounting Type Surface Mount
• Speed 25MHz
• RAM Size 3K x 8
• Operating Temperature 0°C ~ 70°C
• Oscillator Type External
• Program Memory Type ROMless
• Core Processor ARM7®
• Core Size 16/32-Bit
• Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
• Connectivity EBI/EMI, SPI, UART/USART
• Peripherals WDT
• Supplier Device Package 144-BGA (13x13)
• Number of I/O 58
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant