技术参数

• Package / Case 516-BBGA Exposed Pad
• Mounting Type Surface Mount
• Speed 333MHz
• Operating Temperature -40°C ~ 105°C (TA)
• Core Processor PowerPC e300c3
• Voltage - I/O 1.8V, 2.5V, 3.3V
• Supplier Device Package 516-TEPBGA (27x27)
• Ethernet 10/100/1000Mbps (2)
• USB USB 2.0 + PHY (1)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP Security; SEC 2.2
• RAM Controllers DDR, DDR2
• Graphics Acceleration No
• Security Features Cryptography
• Additional Interfaces DUART, HSSI, I2C, PCI, SPI
• ECCN 5A002A1 NXP
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant