技术参数

• Package / Case 177-LFBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, Ethernet, DMA, HDLC, I2C, SPI, UART
• RAM Size External
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 1.8V, 3.3V
• Program Memory Type External Program Memory
• Applications Network Processor
• Core Processor ARM9®
• Supplier Device Package 177-BGA (13x13)
• Number of I/O 54
• DigiKey Programmable Not Verified
• California Prop 65 California Prop 65 Information
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS Compliant