技术参数

• Package / Case 176-LFBGA
• Mounting Type Surface Mount
• Speed 20MHz
• Program Memory Size 160KB (160K x 8)
• RAM Size 8K x 8
• Operating Temperature -20°C ~ 75°C (TA)
• Oscillator Type External
• Program Memory Type FLASH
• Core Processor H8S/2600
• Data Converters A/D 16x10b
• Core Size 16-Bit
• Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
• Connectivity FIFO, I2C, LPC, SCI, SmartCard
• Peripherals POR, PWM, WDT
• Supplier Device Package 176-LFBGA (13x13)
• Number of I/O 128
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant