技术参数

• Package / Case 224-LFBGA
• Mounting Type Surface Mount
• Speed 480MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 1M x 8
• Operating Temperature -40°C ~ 125°C (TJ)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 12K x 8
• Core Processor ARM® Cortex®-M85
• Data Converters A/D 25x12b SAR; D/A 2x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.65V ~ 3.6V
• Connectivity CANbus, Ethernet, I2C, MMC/SD, QSPI, SCI, Serial Sound, SmartCard, SPI, UART/USART, USB
• Peripherals AES, DMA, LVD, POR, PWM, RSA, Temp Sensor, WDT
• Supplier Device Package 224-BGA (13x13)
• Number of I/O 165
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant