技术参数

• Package / Case 25-XFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 24MHz
• Program Memory Size 64KB (64K x 8)
• RAM Size 8K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M0+
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 5.5V
• Connectivity I2C, Microwire, SPI, SSP, UART/USART
• Peripherals Brown-out Detect/Reset, CapSense, POR, PWM, WDT
• Supplier Device Package 25-WLCSP (1.96x2.05)
• Number of I/O 21
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant