技术参数

• Package / Case 357-LFBGA
• Mounting Type Surface Mount
• Speed 128MHz
• Program Memory Size 992KB (992K x 8)
• RAM Size 60K x 8
• Operating Temperature -40°C ~ 125°C (TA)
• Program Memory Type FLASH
• EEPROM Size 32K x 8
• Core Processor V850E1
• Data Converters A/D 20x10b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V, 3V ~ 3.6V
• Connectivity CANbus, CSIO, FlexRay, UART/USART
• Peripherals DMA, PWM, RNG, WDT
• Supplier Device Package 357-LFBGA (20x20)
• Number of I/O 143
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant