技术参数

• Package / Case 150-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 160MHz
• Program Memory Size 4MB (4M x 8)
• RAM Size 2.5M x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M33
• Data Converters A/D 22x12/14b SAR; D/A 2x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
• Connectivity CANbus, EBI/EMI, FIFO, I2C, IrDA, LINbus, MMC/SD, SPI, UART/USART/USB
• Peripherals Brown-out Detect/Reset, Crypto - AES, DMA, LCD, PWM, SHA, Temp Sensor, TRNG, WDT
• Supplier Device Package 150-WLCSP (5.38x5.47)
• Number of I/O 108
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant