技术参数

• Package / Case 337-LFBGA
• Mounting Type Surface Mount
• Speed 160MHz
• Program Memory Size 2MB (2M x 8)
• RAM Size 160K x 8
• Operating Temperature -55°C ~ 125°C (TA)
• Oscillator Type External
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-R4F
• Data Converters A/D 24x12b
• Core Size 16/32-Bit
• Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V
• Connectivity CANbus, EBI/EMI, LINbus, SCI, SPI, UART/USART
• Peripherals DMA, POR
• Supplier Device Package 337-NFBGA (16x16)
• Number of I/O 115
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant