技术参数

• Package / Case 19-PowerDIP Module (1.205", 30.60mm)
• Mounting Type Through Hole
• Type IGBT
• Configuration Half Bridge
• Voltage - Isolation 1500Vrms
• Current 120 A
• Voltage 300 V
• ECCN EAR99
• HTSUS 8541.29.0095
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected