技术参数

• Package / Case 156-LFBGA
• Mounting Type Surface Mount
• Speed 240MHz
• Program Memory Size 2MB (2M x 8)
• RAM Size 448K x 8
• Operating Temperature -40°C ~ 150°C
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 64K x 8
• Core Processor RH850G3M
• Data Converters A/D 16x12b
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, LINbus, SCI, SPI, SSI, UART/USART, USB
• Peripherals DMA, POR, PWM, Temp Sensor, WDT
• Supplier Device Package 156-FBGA (10x10)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant