技术参数

• Package / Case 233-FBGA
• Mounting Type Surface Mount
• Speed 240MHz
• Program Memory Size 3MB (3M x 8)
• RAM Size 384K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 128K x 8
• Core Processor RH850G3KH
• Data Converters A/D 20x10b, 16x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
• Connectivity CANbus, CSI, I2C, LINbus, UART/USART
• Peripherals DMA, LVD, PWM, WDT
• Supplier Device Package 233-FBGA (15x15)
• Number of I/O 174
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant