技术参数

• Package / Case 373-FBGA
• Mounting Type Surface Mount
• Speed 400MHz
• Program Memory Size 8MB (8M x 8)
• RAM Size 768K x 8
• Operating Temperature -40°C ~ 150°C (TJ)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 224K x 8
• Core Processor RH850G4MH
• Data Converters A/D 80x10b, 80x12b SAR
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V, 3V ~ 5.5V
• Connectivity CANbus, CSI, Ethernet, FlexRay, LINbus, PSI5S, SCI, SENT, UART/USART
• Peripherals DMA, PWM, Temp Sensor, WDT
• Supplier Device Package 373-FBGA (21x21)
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant