技术参数

• Package / Case 18-DIP (0.300", 7.62mm)
• Mounting Type Through Hole
• Program Memory Size 1KB (1K x 8)
• RAM Size 124 x 8
• Operating Temperature 0°C ~ 70°C (TA)
• Oscillator Type External, Internal
• Program Memory Type ROM
• Core Processor Z8
• Core Size 8-Bit
• Voltage - Supply (Vcc/Vdd) 2V ~ 3.6V
• Peripherals POR, WDT
• Supplier Device Package 18-DIP
• Number of I/O 14
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant