技术参数

• Package / Case 269-LFBGA
• Mounting Type Surface Mount
• RAM Size 5.5M x 8
• Program Memory Type ROMless
• Core Processor e200z4, e200z7
• Core Size 32-Bit Dual-Core
• Connectivity CANbus, Ethernet, FlexRay, QSPI, SPI
• Peripherals Temp Sensor
• Supplier Device Package 269-LFBGA (14x14)
• ECCN 5A992C
• HTSUS 8542.31.0001
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant