技术参数

• Package / Case 100-LQFP Exposed Pad
• Mounting Type Surface Mount
• Speed 150MHz
• Program Memory Size 512KB (512K x 8)
• RAM Size 256K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M33
• Data Converters A/D 10x16b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.8V ~ 3.6V
• Connectivity Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
• Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Supplier Device Package 100-HLQFP (14x14)
• Number of I/O 64
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant