技术参数

• Package / Case 609-BFBGA
• Mounting Type Surface Mount
• Speed 1.2GHz, 264MHz
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor ARM® Cortex®-A53, ARM® Cortex®-M4F
• Voltage - I/O 1.8V, 2.5V, 3.3V
• Supplier Device Package 609-FBGA (21x21)
• Ethernet 10/100/1000Mbps (1)
• USB USB 2.0 + PHY (2)
• Number of Cores/Bus Width 3 Core, 64-Bit
• Co-Processors/DSP Multimedia; NEON
• RAM Controllers DDR3L, DDR4, LPDDR4
• Graphics Acceleration Yes
• Display & Interface Controllers MIPI-CSI, MIPI-DSI
• Security Features ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
• Additional Interfaces CANbus, I2C, PCIe, SDHC, SPI, UART
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant