技术参数

• Package / Case 176-LQFP Exposed Pad
• Mounting Type Surface Mount
• Speed 240MHz
• Program Memory Size 1.5625MB (1.5625M x 8)
• RAM Size 544K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 112K x 8
• Core Processor ARM® Cortex®-R5F
• Data Converters A/D 48x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
• Connectivity CANbus, CSIO, I2C, LINbus, UART/USART
• Peripherals DMA, I2S, LVD, POR, PWM, WDT
• Supplier Device Package 176-TEQFP (24x24)
• Number of I/O 150
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant