技术参数

• Package / Case 208-LQFP Exposed Pad
• Mounting Type Surface Mount
• Speed 240MHz
• Program Memory Size 2.0625MB (2.0625M x 8)
• RAM Size 2.25K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-R5F
• Data Converters A/D 50x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.15V ~ 5.5V
• Connectivity CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
• Peripherals DMA, I2S, LCD, LVD, POR, PWM, WDT
• Supplier Device Package 208-TEQFP (28x28)
• Number of I/O 120
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant