技术参数

• Package / Case 64-LFBGA
• Mounting Type Surface Mount
• Speed 100MHz
• Program Memory Size 512KB (512K x 8)
• RAM Size 128K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 8K x 8
• Core Processor ARM® Cortex®-M33
• Data Converters A/D 11x12b SAR; D/A 2x12b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
• Connectivity CANbus, EBI/EMI, I2C, QSPI, SCI, SPI, SSI, UART/USART, USB
• Peripherals Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT
• Supplier Device Package 64-LFBGA (6x6)
• Number of I/O 45
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant