技术参数

• Package / Case 256-BBGA
• Mounting Type Surface Mount
• Speed 66MHz
• Operating Temperature -40°C ~ 100°C (TA)
• Core Processor MPC8xx
• Voltage - I/O 3.3V
• Supplier Device Package 256-PBGA (23x23)
• Ethernet 10Mbps (1), 10/100Mbps (2)
• USB USB 2.0 (1)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP Communications; CPM, Security; SEC
• RAM Controllers DRAM
• Graphics Acceleration No
• Security Features Cryptography
• Additional Interfaces HDLC, I2C, PCMCIA, SPI, TDM, UART