技术参数

• Package / Case 20-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 50MHz
• Program Memory Size 16KB (16K x 8)
• RAM Size 4K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 2K x 8
• Core Processor ARM® Cortex®-M0
• Data Converters A/D 8x10b SAR; D/A 1x10b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 2.6V ~ 3.6V
• Connectivity I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals Brown-out Detect/Reset, POR, WDT
• Supplier Device Package 20-WLCSP (2.5x2.5)
• Number of I/O 18
• ECCN 3A991A2