技术参数

• Package / Case 100-TFBGA
• Mounting Type Surface Mount
• Speed 180MHz
• RAM Size 360K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type External, Internal
• Program Memory Type ROMless
• Core Processor ARM® Cortex®-M4
• Data Converters A/D 12x12b SAR
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
• Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Supplier Device Package 100-TFBGA (9x9)
• Number of I/O 64