技术参数

• Package / Case 25-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 50MHz
• Program Memory Size 32KB (32K x 8)
• RAM Size 8K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M0
• Data Converters A/D 6x8b SAR
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.65V ~ 1.95V
• Connectivity I2C, SPI, SSP, UART/USART
• Peripherals Brown-out Detect/Reset, POR, WDT
• Supplier Device Package 25-WLCSP (2.17x2.32)
• Number of I/O 21
• ECCN 3A991A2