技术参数

• Package / Case 760-BFBGA, FCBGA
• Mounting Type Surface Mount
• Speed 1.5GHz
• Operating Temperature -40°C ~ 105°C (TJ)
• Core Processor ARM® Cortex®-A15
• Voltage - I/O 1.8V, 3.3V
• Supplier Device Package 760-FCBGA (23x23)
• Ethernet 10/100/1000Mbps (1)
• USB USB 2.0 + PHY (2), USB 3.0 + PHY (2)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP ARM® Cortex®-M4, C66x
• RAM Controllers DDR3, SRAM
• Graphics Acceleration No
• Display & Interface Controllers HDMI, LCD
• Security Features 3DES, AES, ARM TZ, Boot Security, Cryptography, MD5, SHA-1/2, TRNG
• SATA SATA 3Gbps (1)
• Additional Interfaces CANbus, DMA, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status ROHS3 Compliant