技术参数

• Package / Case 112-LFBGA
• Mounting Type Surface Mount
• Speed 450MHz
• RAM Size 1.568M x 8
• Operating Temperature -40°C ~ 110°C (TJ)
• Oscillator Type Internal
• Program Memory Type ROMless
• Core Processor ARM® Cortex®-R4F
• Data Converters A/D 16x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.14V ~ 3.6V
• Connectivity CSI, I2C, SPI, UART/USART
• Peripherals DMA, POR, PWM, WDT
• Supplier Device Package 112-FBGA (6x6)
• Number of I/O 51
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant