技术参数

• Package / Case 115-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 80MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 320K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M4F
• Data Converters A/D 16x12b SAR; D/A 2x12b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 3.6V
• Connectivity CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
• Peripherals Brown-out Detect/Reset, DMA, LCD, PWM, WDT, (External SMPS Required)
• Supplier Device Package 115-WLCSP (4.63x4.15)
• Number of I/O 86
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant