技术参数

• Package / Case 115-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 550MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 564K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M7
• Data Converters A/D 43x12/16b; D/A 2x12b
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.62V ~ 3.6V
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MDIO, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, SWPMI, UART/USART, USB OTG
• Peripherals Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
• Supplier Device Package 115-WLCSP (3.73x4.15)
• Number of I/O 67
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant