技术参数

• Package / Case 386-FBGA
• Mounting Type Surface Mount
• Speed 200MHz
• Program Memory Size 10MB (10M x 8)
• RAM Size 1.25M x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• EEPROM Size 256K x 8
• Core Processor e200z4
• Data Converters A/D 96x10/12b SAR
• Core Size 32-Bit Tri-Core
• Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
• Connectivity eMMC/SD/SDIO, I2C, LINbus, PSI5, SPI, UART/USART
• Peripherals DMA, POR, WDT
• Supplier Device Package 386-FPBGA (19x19)
• Grade Automotive
• Number of I/O 205
• Qualification AEC-Q100
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant