技术参数

• Package / Case 292-FBGA
• Mounting Type Surface Mount
• Speed 240MHz
• Program Memory Size 4MB (4M x 8)
• RAM Size 1.0625M x 8
• Operating Temperature -40°C ~ 150°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 128K x 8
• Core Processor RH850G3M
• Data Converters A/D 32x12b
• Core Size 32-Bit Quad-Core
• Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
• Connectivity CANbus, CSI, FIFO, FlexRay, LINbus, SENT, SPI, UART/USART
• Peripherals DMA, POR, PWM, Temp Sensor, WDT
• Supplier Device Package 292-FBGA (17x17)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant