技术参数

• Package / Case 16-UFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 48MHz
• Program Memory Size 16KB (16K x 8)
• RAM Size 8K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 2K x 8
• Core Processor ARM® Cortex®-M23
• Data Converters A/D 4x12b SAR
• Core Size 32-Bit
• Voltage - Supply (Vcc/Vdd) 1.6V ~ 5.5V
• Connectivity I2C, I3C, SCI, SmartCard, SPI, UART/USART
• Peripherals AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
• Supplier Device Package 16-WLCSP (1.84x1.87)
• Number of I/O 11
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant