技术参数

• Package / Case 116-WFBGA
• Mounting Type Surface Mount
• Speed 100MHz, 150MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 288K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M4F
• Data Converters A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
• Connectivity FIFO, I2C, IrDA, LINbus, Microwire, QSPI, SmartCard, SPI, SSP, UART/USART
• Peripherals Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
• Supplier Device Package 116-BGA (5.2x6.4)
• Number of I/O 78
• DigiKey Programmable Not Verified
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant