技术参数

• Package / Case 272-BGA
• Mounting Type Surface Mount
• Speed 240MHz
• Program Memory Size 4.063MB (4.063M x 8)
• RAM Size 384K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Program Memory Type FLASH
• EEPROM Size 128K x 8
• Core Processor ARM® Cortex®-M0+, ARM® Cortex®-M7F
• Core Size 32-Bit Dual-Core
• Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V
• Connectivity DMA, I2S, LVD, Temp Sensor, WDT
• Peripherals DMA, I2S, LVD, Temp Sensor, WDT
• Supplier Device Package 272-BGA
• Number of I/O 135
• DigiKey Programmable Not Verified
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant